High Strength Silver Conductive Epoxy Resin Adhesive for Electronic Components Bonding

Still deciding? Get samples of $ !
Order Sample

Product Description

Basic Information
Model NO.EP-01-10ColorSilver
CompositionOrganic MaterialMorphologyResin
Basic ChemicalEpoxyMixing RatioA:B=10:1
Cure Time25℃*12-24h / 80℃*1hSpecification50ml
OriginChinaHS Code3506100000
Product Description
EP-01 is a two-component silver conductive epoxy AB adhesive with stable performance and excellent bonding strength. It provides reliable electrical and thermal conductivity, widely used for conductive bonding between various materials.

Core Advantages

High bonding strength and stable performance
Excellent electrical conductivity with low volume resistance
High thermal conductivity for efficient heat dissipation
Wide working temperature range (-40~ +200℃)
Good adhesion to metal, ceramic, glass and other substrates
Conductive Epoxy Resin
Applications
ItemUnitParameter (EP-01AB)
Color-Silver
Operational Time25℃ / h2
Shearing Strength (Al-Al)kg/cm³>50
Thermal ConductivityW/(m*K)8.5
Volume Resistanceohm*cm1×10⁻³ ~ 3×10⁻⁴
Applications
Electronic Bonding
Assembly
  • Conductive bonding of metal components
  • Electronic components assembly and connection
  • Circuit repair and fixing
  • High thermal conductivity connection parts

Operation Guide

  1. Stir Part A for 3-5min before use.
  2. Mix A:B = 10:1 by weight and stir thoroughly.
  3. Apply mixture (0.05-0.1mm thickness).
  4. Wait 5-10min before connecting components.

Storage & Note

  • Store as non-dangerous goods.
  • Keep application surfaces dry and clean.
  • Avoid long-term direct contact with Part B.
Company Partners
Partners

Frequently Asked Questions

Q1: What are the main applications of this silver conductive epoxy? It is primarily used for electronic component assembly, circuit repair, and bonding metal, ceramic, or glass where both electrical and thermal conductivity are required.
Q2: How do you ensure the quality of the adhesive? We implement a strict three-step QC system: pre-production sample confirmation, in-production real-time monitoring, and 100% final inspection before shipment.
Q3: Can this glue be cured at room temperature? Yes, it can be cured at room temperature (25℃) within 12-24 hours, or heat-cured at 80℃ for 1 hour for faster production.
Q4: What is the mixing ratio for EP-01? The mixing ratio is A:B = 10:1 by weight. It is important to stir Part A individually before mixing them together.
Q5: What is the working temperature range after curing? Once fully cured, the adhesive can operate stably in environments ranging from -40℃ to +200℃.
Q6: What other thermal management products do you offer? We provide a comprehensive range including Thermal Gap Pads, Thermal Gel, Thermal Grease, and various electronic bonding solutions.

Related Products